Liquid film–induced critical heat flux enhancement on structured surfaces-Reference-Cited by-同舟云学术

Liquid film–induced critical heat flux enhancement on structured surfaces

Author:

Li Jiaqi¹^ORCID,Kang Daniel¹,Fazle Rabbi Kazi¹^ORCID,Fu Wuchen¹^ORCID,Yan Xiao¹^ORCID,Fang Xiaolong¹,Fan Liwu²^ORCID,Miljkovic Nenad¹³⁴⁵^ORCID

Affiliation:

1. Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.

2. Institute of Thermal Science and Power Systems, School of Energy Engineering, Zhejiang University, Hangzhou 310027, China.

3. Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.

4. Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.

5. International Institute for Carbon Neutral Energy Research (WPI-I2CNER), Kyushu University, 744 Moto-oka, Nishi-ku, Fukuoka 819-0395, Japan.

Abstract

A liquid film with two distinct contact lines underneath bubbles during boiling on structured surfaces has been discovered.

Funder

National Science Foundation

Office of Naval Research

International Institute for Carbon Neutral Energy Research

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

Reference55 articles.

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