A high-performance solid-state electrocaloric cooling system

Author:

Wang Yunda1ORCID,Zhang Ziyang1ORCID,Usui Tomoyasu2ORCID,Benedict Michael1ORCID,Hirose Sakyo2ORCID,Lee Joseph1,Kalb Jamie1ORCID,Schwartz David1ORCID

Affiliation:

1. PARC, A Xerox Company, 3333 Coyote Hill Rd., Palo Alto, CA 94304, USA.

2. Murata Manufacturing Co., Ltd., 1-10-1, Higashikotari, Nagaokakyo, Kyoto 617-8555, Japan.

Abstract

Competitive cooling with capacitors Current large-scale cooling devices use vapor compression refrigeration. The efficiency of air conditioners has been optimized, but they can be noisy and rely on problematic greenhouse gases. Two groups now present designs for electrocaloric cooling using lead scandium tantalate capacitors that change temperature under an electric field. Y. Wang et al. obtained a very large heat flux using only solid materials and a cooling fan to remove heat from their device. Torello et al. used fluids for heat transfer, leading to a very large temperature difference between the hot side and the cold side. The new designs demonstrate the potential for devices that might be competitive with vapor compression–based appliances with further optimization. Science , this issue p. 129 , p. 125

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

Reference48 articles.

1. International Energy Agency (IEA) “The future of cooling: Opportunities for energy efficient air conditioning” (Report IEA 2018).

2. S. Sneha I. Campbell A Kalanki “Solving the global cooling challenge: How to counter the climate threat from room air conditioners” (Report Rocky Mountain Institute 2018).

3. S. Trutassanawin A. Eckhard paper presented at the International Refrigeration and Air Conditioning Conference paper R172 Purdue University West Lafayette IN 2004.

4. Advanced EO/IR technologies at DARPA/MTO

5. Numerical analysis on the cooling of a laser diode package with a thermoelectric cooler

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