Electronic Bonding Revealed by Electron Diffraction-Reference-Cited by-同舟云学术

Electronic Bonding Revealed by Electron Diffraction

Published:2011-03-25 Issue:6024 Volume:331 Page:1528-1529
ISSN:0036-8075
Container-title:Science
language:en
Short-container-title:Science

Author:

Midgley Paul A.¹

Affiliation:

1. Department of Materials Science and Metallurgy, University of Cambridge, Pembroke Street, Cambridge CB2 3QZ, UK.

Abstract

A new electron diffraction method reveals a tetrahedral bond network in aluminum that can account for the directional nature of its mechanical properties.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

Reference9 articles.

1. The Bonding Electron Density in Aluminum

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3. Three-dimensional model of purple membrane obtained by electron microscopy

4. Double conical beam-rocking system for measurement of integrated electron diffraction intensities

5. A new method of determining the atom form factor by high-voltage electron diffraction. An application of the effect of vanishing of the second-order reflexion

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