One-Dimensional Fast Migration of Vacancy Clusters in Metals
Author:
Affiliation:
1. Materials Science and Technology Division, Oak Ridge National Laboratory (ORNL), Post Office Box 2008, TN 37831–6138, USA.
2. Center for Materials Processing, University of Tennessee, Knoxville, TN 37996–0750, USA.
Abstract
Publisher
American Association for the Advancement of Science (AAAS)
Subject
Multidisciplinary
Reference30 articles.
1. B. N. Singh, in Encyclopedia of Materials: Science and Technology, K. H. J. Buschow et al., Eds. (Elsevier, New York, 2001), pp. 7957–7972.
2. Defect cluster formation in displacement cascades in copper
3. Molecular dynamics calculations of displacement threshold energies and replacement collision sequences in copper using a many-body potential
4. One-dimensional atomic transport by clusters of self-interstitial atoms in iron and copper
5. Dynamics of self-interstitial cluster migration in pure α-Fe and Fe-Cu alloys
Cited by 171 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Solitary cluster waves in periodic potentials: Formation, propagation, and soliton-mediated particle transport;Chaos, Solitons & Fractals;2024-08
2. Atomistic Insights into the Irradiation Resistance of Co-Free High Entropy Alloy FeMnNiCr;Acta Metallurgica Sinica (English Letters);2024-06-28
3. Controlled creation of point defects in three-dimensional colloidal crystals;Physical Review E;2024-06-04
4. Identification of self-interstitial atoms and vacancies in crystalline materials in atomistic simulation;Computer Physics Communications;2024-06
5. Introducing vacancy defects by rapid quenching in FCC metal for deep learning micrograph dataset;Materials Characterization;2024-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3