Wafer-scale integration of stretchable semiconducting polymer microstructures via capillary gradient

Abstract

Abstract Organic semiconducting polymers have opened a new paradigm for soft electronics due to their intrinsic flexibility and solution processibility. However, the contradiction between the mechanical stretchability and electronic performances restricts the implementation of high-mobility polymers with rigid molecular backbone in highly deformable devices. Here, we report the realization of high electronic performance and high stretchability on curvilinear polymer microstructures fabricated by solution-processing capillary-gradient-mediated assembly method. Curvilinear polymer microstructure arrays are fabricated with highly ordered molecular packing, precisely controlled geometry and alignment, and wafer-scale homogeneity, leading to high hole mobilities of 4.3 and 2.6 cm2 V− 1 s− 1 under zero and 100% strain, respectively. Fully stretchable field-effect transistors and logic circuits can be integrated through all-solution process using assembled curvilinear microstructure semiconducting channels, organic dielectrics and carbon-nanotube electrodes. Based on these fully stretchable devices, 92% preservation of carrier mobility is realized after 1000 stretch-release cycle under 50% strain. Long-range homogeneity is demonstrated with the narrow distribution of height, width, mobility, on-off ratio and threshold voltage across a four-inch wafer. This solution-assembly method provides a platform for wafer-scale and reproducible integration of high-performance soft electronic devices and circuits based on conjugated organic semiconductors.