Abstract
The quest for effective thermal management solutions for microelectronic devices, catering to the escalating heat flows, necessitates innovative strategies. The significance of thermal interface materials, especially thermal greases, in minimizing thermal resistance within the "microelectronic device – heat-dissipating element" interface, has been widely acknowledged across industries such as microelectronics, aviation, and space engineering. Despite the promising reported values, a crucial consideration entails the method of ascertaining thermal conductivity, necessitating measurements in bulk samples to ensure accurate representations. Graphite, owing to its commercial accessibility and commendable thermal conductivity, emerges as a standout candidate for composite material development, as demonstrated in recent research. We observed that the use of graphite-based fillers, particularly in the form of well-crystallized graphite particles, effectively reduced processor temperatures and enhanced thermal conductivity, outperforming industrially utilized thermal pastes. Our findings accentuate the potential of these materials in contributing to the development of cutting-edge composite materials for microelectronics, highlighting their high prospects for future applications in high-performance devices.