A Robust Lateral Shift Free (LSF) Electrothermal Micromirror With Flexible Multi-Morph Beams

Author:

Xie Huikai1,Yang Hengzhang1,Ren Anrun1,Ding Yingtao1,Xiao Lei1,Pan Teng1,Yan Yangyang2,Jiao Wenlong2

Affiliation:

1. Beijing Institute of Technology

2. BIT Chongqing Institute of Microelectronics and Microsystems

Abstract

Abstract Electrothermal bimorph-based scanning micromirrors typically employ widely-used silicon dioxide (SiO2) as the electrical and thermal isolation material. However, due to the brittle nature of SiO2, such micromirrors may not be able to even survive a slight collision, which greatly limits their application range. To improve the robustness of electrothermal micromirrors, a polymer material is incorporated to partially replace SiO2 as the electrical and thermal isolation material as well as the anchor material. In particular, photosensitive polyimide (PSPI) is used to simplify the fabrication process. In this work, PSPI-based electrothermal micromirrors have been designed, fabricated and tested. The PSPI-type micromirrors achieved a maximum optical scan angle of ± 19.6 ° and a maximum vertical displacement of 370 µm both at only 4 Vdc. With a mirror aperture size of 1mm × 1 mm, the PSPI-type micromirrors withstood over 200 g accelerations from either vertical or lateral directions in the impact experiment. In the drop test, the PSPI-type micromirrors survived falls to a hard floor at heights up to 21 cm. In the standard frequency sweeping vibration test, the PSPI-type micromirrors withstood 21 g and 29 g acceleration in the vertical and lateral vibration, respectively. In all these experimental tests, the PSPI-type micromirrors demonstrated at least 4 times better robustness compared to the SiO2-type micromirrors fabricated in the same batch.

Publisher

Research Square Platform LLC

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