Boron nitride whiskers and nano alumina synergistically enhancing the vertical thermal conductivity of epoxy-cellulose aerogel nanocomposites

Author:

Li Zhaoyang1,Pan Duo1,Han Ziyuan1,Kumar D. Jaya Prasanna2,Ren Juanna3,Hou Hua3,El-Bahy Zeinhom M.4,Mersal Gaber A. M.5,Xu Ben Bin6,Liu Yongzhi1,Liu Chuntai1,Ibrahim Mohamed M.5

Affiliation:

1. Key Laboratory of Materials Processing and Mold (Zhengzhou University), Ministry of Education; National Engineering Research Center for Advanced Polymer Processing Technology, Zhengzhou University

2. Department of Chemical Engineering, Ramaiah Institute of Technology

3. College of Materials Science and Engineering, Taiyuan University of Science and Technology

4. Department of Chemistry, Faculty of Science, Al-Azhar University

5. Department of Chemistry, College of Science, Taif University

6. Mechanical and Construction Engineering, Faculty of Engineering and Environment, Northumbria University

Abstract

Abstract With the continuous innovation of electronic information technology, thermal interface materials, which mainly play the role of heat dissipation in microelectronic devices, will face great challenges. In this work, the boron nitride whiskers (BNWK)@Al2O3/cellulose aerogels (CA) obtained by electrostatic self-assembly one-dimensional BNWK and zero-dimensional nano-Al2O3 combined with directional freezing of CA. The obtained BNWK@Al2O3/CA not only has a unique vertical network structure, but also exhibits exceptional compressive mechanical strength, especially when the mass ratio of BNWK/nano-Al2O3 is 1:7, the compressive strength of BNWK@Al2O3(1:7)/CA reaches 97 kPa, based on the flexibility of the CA and the support of the rigid hybrid filler BNWK@Al2O3, the theoretical relaxation time of the composite is also as high as 25327 s. Furthermore, the thermal conductivity of the epoxy-based composite (BNWK@Al2O3/CA/EP) with a filler loading of 8.6 wt% is about 1.92 W/(m·K), which is 9.6 times that of pure EP, the excellent thermally conductive property is due to the accelerated phonon transport by the vertically arranged BNWK@Al2O3 network structure. Hence, this work provides a new idea for developing a new generation of thermal interface materials.

Publisher

Research Square Platform LLC

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