Plating microstructure control by ultrasonic application to hot-dip galvanizing

Abstract

Abstract The application of ultrasonic to molten metal has many effects, such as improving its wettability and fracturing the oxide layer. However, a few research studies have been done to apply ultrasound to the Hot-Dip Galvanizing plating method. This study focuses on improving the interfacial bonding strength and removing the oxide layer using ultrasonic waves. In this study, a high-tensile steel plate will be plated with ultrasonic waves, and the plated steel will be examined by microstructure observation and the mechanical properties of the interfacial bonding structure between SUS310S and Zn-Al alloy. It was confirmed that ultrasound waves affect the removal of impurities and pores between the SUS310S steel plate and the interface of the Zn-0.13 wt.% Al alloy during Hot-Dip galvanizing process. Furthermore, to observe the effect of ultrasonic waves on the removal of oxides, a kind of impurity, from the surface of SUS310S, an oxide layer having a thickness of 2 µm was deposited on the surface of SUS310S by Physical Vapor Deposition (PVD). When ultrasonic waves were applied to the oxide-coated SUS 310S surface for 60 seconds, a part of the oxide layer was fractured by the cavitation effect of ultrasonic.