Affiliation:
1. University of New Hampshire
2. University of Colorado
3. National Institute of Standards and Technology
Abstract
Abstract
In this work, we are reporting on the development of a method to attach Sn absorbers to the Transition Edge Sensors (TESs) with BiSn spheres (metal-to-metal attachment), using a die bonder, with the aim of improving thermalization, potentially reducing the presence of an a-thermal component in the tails of signal pulses. We describe our efforts towards finding optimal temperature and pressure conditions for making this contact and the progress toward contact resistance measurements of these joints.
Publisher
Research Square Platform LLC
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