Wafer-scale lithography of silicone-integrated hole transporters for anti-pixel crosstalk organic light-emitting diodes

Author:

Kim Do Hwan1ORCID,Kweon Hyukmin1,Kim Seonkwon2,Ha Borina1,Lee Seunghan3,Lee Soyeon1,Ha Jiyeon1,Kang Minsu2,Roh Seung Hwan3,Kang Moon Sung3ORCID,Cho Jeong Ho2ORCID

Affiliation:

1. Hanyang University

2. Yonsei University

3. Sogang University

Abstract

Abstract Ultrahigh-density displays are becoming increasingly prevalent in display technology for immersive digital interactive devices. However, the pursuit of higher pixel resolution has inadvertently led to the emergence of electrical pixel crosstalk, primarily due to the use of common hole transporting layers (HTLs). In this work, we present wafer-scale, anti-pixel crosstalk micro-lithography to mitigate electrical pixel crosstalk by incorporating a silicone-integrated small molecule HTL (SI-HTL), which not only enables ultrahigh-density pixelation but also enhances the functionality of the HTL itself. Leveraging the inherent silicon etching properties of SI-HTL, we successfully created high-fidelity micro-pattern arrays with a remarkable resolution of up to 10,062 pixels per inch on 6-inch wafer scales. Furthermore, SI-HTL effectively modulates charge balance within the emission layers, resulting in improved luminance characteristics in organic light-emitting diodes (OLEDs). Our comprehensive optical and quantitative assessment of electrical pixel crosstalk in OLEDs integrated with micro-patterned SI-HTL demonstrates the significant effectiveness of high pixelation of the HTL in alleviating the crosstalk issue.

Publisher

Research Square Platform LLC

Reference43 articles.

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