Experimental investigation comparing thermal performance of parallel and counter flow in 3D printed triangular cross section dual microchannel heat sink with rough wall surface

Author:

Nadarajah Puurnaraj1,Mohamed Khairudin1,Abdullah Jamaluddin1,Devarajan Mutharasu2

Affiliation:

1. Universiti Sains Malaysia

2. Western Digital Technologies Inc

Abstract

Abstract An additive manufactured triangular cross section microchannel heat sink (MCHS) is experimentally investigated by comparing parallel and counter flow arrangement. It consists of dual microchannel with hydraulic diameter of 650 µm, where the emphasize is given on the influence of flow configuration and rough wall structure on thermal performance of MCHS. Pressure drop, Nusselt number, thermal resistances, thermal performance index and temperature gradient across microchannel are evaluated and compared. For flow rate between 1 ml/min - 5 ml/min, counter flow offers more uniform temperature distribution across MCHS surface at a maximum difference of 37.2% and generates lower pressure drop by at least 25 % compared to parallel flow configuration. As Reynold number exceeds 140, parallel flow Nusselt number is greater which leads to superior thermal performance index (TPI) between 12.7 % - 25.9 %. Convective thermal resistance is found to be the dominant thermal resistance compared to capacitive and conductive thermal resistance. To conclude, at flow rate below 5 ml/min, counter flow offers the best thermal performance due a more uniform thermal gradient across MCHS surface and negligible differences in TPI between both flows configuration. At a higher flow rate of 5 ml/min and above, thermal gradient is independent of flow configuration and parallel flow is preferred due to higher TPI.

Publisher

Research Square Platform LLC

Reference24 articles.

1. High-Performance Heat Sinking for VLSI;Tuckerman DB;IEEE Electron Device Lett EDL,1981

2. Ramesh KN, Sharma TK, Rao GAP (2021) Latest Advancements in Heat Transfer Enhancement in the Micro-channel Heat Sinks: A Review. Springer Netherlands. https://doi.org/10.1007/s11831-020-09495-1

3. Analysis of two!layered micro!channel heat sink concept in electronic cooling;Kambiz V;Int J Heat Mass Transf 31,1999

4. Effect of microchannel heat sink configuration on the thermal performance and pumping power;Vasilev MP;Int J Heat Mass Transf,2019

5. The thermal performance of three-layered microchannel heat sink with tapered channel profile;Zuo JW;J Adv Res Fluid Mech Therm Sci,2019

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3