Abstract
The rapid evolution and expansion of digital infrastructures has underscored the significance of electromagnetic interference (EMI) shielding composites. However, there has been a notable dearth of efforts to explore EMI shielding performance in the context of elevated temperatures. This study introduces hollow glass microspheres (HGM) to enhance the EMI shielding performance of carbon fiber (CF)-embedded conductive cement under elevated temperatures. Experimental outcomes delineate the impact of HGM inclusion on compressive strength, electrical and thermal conductivities, and EMI shielding performance. HGM incorporation is observed to reduce thermal conductivity, consequently improving EMI shielding performance at elevated temperatures by decreasing reflection and increasing absorption properties. The investigation incorporates comprehensive analyses, including XRD, TG, MIP, and micro-CT, to systematically examine the EMI shielding test outcomes at elevated temperatures. In conclusion, the utilization of HGM has the potential to yield super lightweight EMI shielding composites with enhanced EMI shielding performance at elevated temperatures.