Additive Manufacturing of Cu/Ni by Selective Electrochemical Deposition on Local Conductive Substrate

Abstract

Abstract Electrodeposition, a typical additive processing method combining electrochemical deposition and additive manufacturing, can realize the additive processing of metal. Herein, a novel additive manufacturing (AM) method was proposed based on electrochemical deposition. Specifically, realized three-dimensional forming of metal by local conductive samples (PLA-CNTs7wt%) as cathode through selectively electrochemical deposition. Moreover, the effect of the deposition time on the surface morphology and quality of the sample was explored. Besides, the method of preparing metal parts in array type solves the problem of slow electrochemical additive manufacturing (ECAM) and provides a new approach for AM to achieve mass production. Then, the prepared copper-nickel multilayer metal samples realized the ECAM of multi-metals. Finally, the 4D printing effect of copper-nickel bimetallic samples was preliminarily explored, and the feasibility of preparing energy storage elements by selective electrochemical deposition was further proved.