Electrical, Microstructural and Physical characteristics of talc-based cordierite ceramics-Reference-Cited by-同舟云学术

Electrical, Microstructural and Physical characteristics of talc-based cordierite ceramics

Published:2022-10-11 Issue: Volume: Page:
ISSN:
Container-title:
language:
Short-container-title:

Author:

Yahya Ahmed¹,Soltan AbdelMonem¹,Mahani Ragab²,El-Kaliouby Baher¹,Kenawy Sayed³,Hamzawy Esmat²

Affiliation:

1. Ain Shams University

2. National Research Centre (NRC)

3. Imam Mohammad Ibn Saud Islamic University (IMSIU)

Abstract

Abstract The aim of this work is to study the effect of various talc rocks for the preparation of talc-based cordierite ceramics. Raw talc and sintered cordierite-based ceramic samples (1000-1375ºC for 2h) were characterized using XRD, XRF, TGA-DTG, laser PSDs, Archimedes method, SEM-EDAX and dielectric relaxation spectrometer (DRS). Results show that impurity oxide contents, particle size and mineralogical changes of green batches influenced the microstructure densification and crystallization of orthorhombic and hexagonal cordierite. The complex electric modulus plot shows the existence of two relaxation processes associated with the capacitive contribution grain boundaries and grain at low and high frequencies, respectively. The dielectric loss reached much lower values (0.0004-0.0007) for the ceramics composed of higher cordierite phase composition (87.00 to 92.00wt.%) that sintered at 1350 and 1375ºC. Such ceramics could be promising in electronic applications like capacitors, microwave devices and wireless communication.

Publisher

Research Square Platform LLC

Reference89 articles.

1. Tasaki T, Shiotani A, Yamaguchi T, Sugimoto K (2017) Low transmission loss flexible substrates using low Dk/Df polyimide adhesives. In: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, pp 54–57

2. Nishimura I, Fujitomi S, Yamashita Y et al (2020) Development of new dielectric material to reduce transmission loss. In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE, pp 641–646

3. Yamamoto K, Koga S, Seino S et al (2020) Low Loss BT resin for substrates in 5G communication module. In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE, pp 1795–1800

4. Kakutani T, Okamoto D, Guan Z et al (2020) Advanced low loss dielectric material reliability and filter characteristics at high frequency for mmWave applications. In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE, pp 653–659

5. Hayes C, Wang K, Bell R et al (2020) High aspect ratio, high resolution, and broad process window description of a low loss photodielectric for 5G HS/HF applications using high and low numerical aperture photolithography tools. In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE, pp 623–628

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Dense, Hard, and Thermally Stable Al6Si2O13–Mg2Al4Si5O18 Composite Material for Silicon Substrate Applications;Silicon;2023-03-10