Computational Study of Rapid Direct Metal Laser Sintering for Compression Mold Manufacturing

Author:

Mirzaei Shokoufeh1,Siaumau Ryan

Affiliation:

1. California State Polytechnic University Pomona

Abstract

Abstract Compression mold tooling fabrication has been traditionally conducted via machining processes—for example, computerized numerical control machining, mill, or lathe operations. While subtractive manufacturing operations provide high-precision tooling, they have an extended lead time and generate material waste, which increases manufacturing costs. This paper analyzes Direct Metal Laser Sintering (DMLS) as a viable alternative to traditional compression mold manufacturing. DMLS is an additive manufacturing process that uses high-powered lasers to fuse metal powders in a layered approach to create high-precision metal components. Through layering materials, DMLS can produce complex geometries which can have features impossible to machine from traditional manufacturing methods. Additionally, DMLS uses less material for parts, reducing material costs and lead times. In this paper, DMLS manufactured mold was computationally studied against a traditional compression mold's thermal and pressure requirements. The DMLS mold was designed with a honeycomb structure to reduce material usage while maintaining structural integrity. Computational Analysis showed that the production requirement, “maximum deflection of 0.001 inches”, was achieved with the DMLS when pressures and temperatures were similar to those required for the tooling. In addition, DMLS-produced mold utilized 74% less material than a traditionally manufactured mold.

Publisher

Research Square Platform LLC

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3