The dielectric property and thermal conductivity properties of epoxy composite filled by P-CdS with patterned surface structure

Abstract

Abstract In order to endow epoxy resins (EP) with good thermal conductivity under the condition of maintaining its good dielectric properties, the new poly(N-isopropylacrylamide-co-methacrylic acid)(P(NIPAM-co-MAA))/CdS (P-CdS) microspheres with patterned surface structures was synthesized by reverse suspension polymerization technique and exogenous deposition method using the P(NIPAM-co-MAA) microgels as the template. The P-CdS microspheres with patterned surface structure were then used as modifier to prepare the P-CdS/EP composites. The chemical structure and surface morphologies of the prepared P-CdS and P-CdS/EP composites were characterized by the SEM, XRD and TGA, and influence of the P-CdS content on the dielectric properties, thermal conductivity and thermal resistant properties of P-CdS/EP composites were also studied. The results showed that the slight addition of P-CdS can highly improve the thermal conductivity and thermal resistance of P-CdS/EP composites, as well as endow EP with high dielectric constant and low dielectric loss at high frequencies. This phenomenon can be attributed to the good dispersibility and excellent electrothermal properties of P-CdS. The purpose of this study is aiming to lay a foundation for the microelectronic components application of EP in high frequency.