Universal Hydrogel Adhesives with Robust Chain Entanglement for Bridging Soft Electronic Materials

Author:

Seo Jungmok1ORCID,Jo Yejin1,Lee Yurim1,Heo Jeong Hyun2,Son Yeonzu3,Kim Tae Young1,Park Kijun1,Kim Soye2,Jin Yoonhee2,Park Seongjun3ORCID

Affiliation:

1. Yonsei University

2. Yonsei University College of Medicine

3. Korea Advanced Institute of Science and Technology (KAIST)

Abstract

Abstract

Ensuring stable integration of diverse soft electronic components for reliable operation under dynamic conditions is crucial. However, integrating soft electronics, comprising various materials like polymers, metals, and hydrogels, poses challenges due to their different mechanical and chemical properties. This study introduces a dried-hydrogel adhesive made of poly(vinyl alcohol) and tannic acid multilayers (d-HAPT), which integrates soft electronic materials through moisture-derived chain entanglement. d-HAPT is a thin (~ 1µm) and highly transparent (over 85% transmittance in the visible light region) adhesive, showing robust bonding (up to 3.6 MPa) within a short time (< 1 min). d-HAPT demonstrates practical application in wearable devices, including a hydrogel touch panel and strain sensors. Additionally, the potential of d-HAPT for use in implantable electronics is demonstrated through in vivo neuromodulation and electrocardiographic recording experiments while confirming its biocompatibility both in vitro and in vivo. It is expected that d-HAPT will provide a reliable platform for integrating soft electronic applications.

Publisher

Springer Science and Business Media LLC

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3