Numerical Analysis of the Desktop CPU's Straight Heatsink via a CFD Simulation Method to Achieve the Optimum Heatsink

Abstract

Abstract The straight heat sink is one of the most common heat transfer components for desktop CPUs in order to manage the dissipation of heat generated by the microprocessor. The primary goal of this study was to find out the optimal straight heat sink, initially by investigating three different fin thicknesses and several fin numbers in order to get the global minimum microprocessor temperature situation for each of those three different fin thicknesses, and finally by considering the mass and temperature of the heat sink in each of those three critical situations in order to get the optimal one. The CFD simulation method was applied to analyze the present study. Solidworks® software was used for both creating CAD models and performing simulations. Initially, it was found that each of the three different fin thicknesses had a turning point at which the microprocessor’s temperature was at its minimum. Later, the weight of the heat sink was also measured at those turning points. Firstly, the heat sink, whose thickness was 1 mm, had a microprocessor temperature of about 83.52 degrees Celsius and a weight of 307.80 grams. Secondly, the heat sink, whose thickness was 1.5 mm, had a microprocessor temperature of about 86.50 degrees Celsius and a weight of 388.80 grams. Thirdly, the heat sink, whose thickness was 2mm, had a microprocessor temperature of about 89.60 degrees Celsius and weighs 448.2 grams. Therefore, the heat sink with less fin thickness was the best one under the criteria of minimum microprocessor temperature and minimum heat sink mass. Because an optimum heat sink—for studied model, fin thickness of 1mm and number of fins of 21—provides a panacea for minimum material cost, light weight, and minimum microprocessor temperature.