Study on the degradation behavior of collagen in electrolytic copper foil and its efficacy

Abstract

Abstract Collagen, as the additive during the process of Electrodeposition of Copper, commonly used to be a leveling agent in the production of electrolytic copper foil (ECF), is effective in refining grain and enhancing mechanical properties of copper foil. However, hydrolysis and electrodeposition cause the loss of collagen may easily arise fluctuation of the additive composition, thus affect the quality of copper foil. For improving the production stability of ECF, it is necessary to explore the hydrolysis properties and mechanism of collagen during copper electrodeposition. Here, we research the efficacy of action and hydrolysis properties of collagen during copper electrodeposition by means of a combination of real-time monitoring and multiple analysis, at the same time, explore the evolution behavior of microstructure, mechanical properties and electrical conductivity in the hydrolysis process of collagen. By the hydrolysis and adsorption of collagen, a significant inhibitory deposition process during copper electrodeposition occurs. Importantly, the inhibitory effect and content of collagen showed a power-index relationship. With the prolongation of hydrolysis time or the volum increase of copper deposition, the hydrolysis rate of collagen decreased sensibly. More, with the addition of collagen, the prepared ECF exhibited a microstructural transformation and its mechanical properties also changed significantly. Therefore, our work reveals the hydrolysis properties and mechanism of collagen in copper foil electrodeposition, which provides an important theoretical reference for the development and application of high performance copper foil.