1. [1] Brglez, F., Bryan, D. and Kozminski, K.: Combinational Profiles of Sequential Benchmark Circuits, Proc. Int. Symp. Circuits and Syst. (ISCAS), pp.1929-1934 (1989).
2. [2] Nassif, S.R.: Modeling and Analysis of Manufacturing Variations, Proc. Custom Integr. Circuits Conf. (CICC), pp.223-228 (2001).
3. [3] Blaauw, D., Chopra, K., Srivastava, A. and Scheffer, L.: Statistical Timing Analysis: From Basic Principles to State of the Art, IEEE Trans. Comput.-Aided Design Integr. Circuits Syst., Vol.27, No.4, pp.589-607 (2008).
4. [4] Dennard, R.H., Gaensslen, F.H., Yu, H.-N., Rideout, V.L., Bassous, E. and Leblanc, A.R.: Design of ion-implanted MOSFETs with very small physical dimensions, IEEE J. Solid-State Circuits, Vol.9, No.5, pp.256-268 (1974).
5. [5] Yang, J., Capodieci, L. and Sylvester, D.: Advanced timing analysis based on post-OPC extraction of critical dimensions, Proc. Design Autom. Conf. (DAC), pp.359-364 (2005).