The present thermal science and beyond-Reference-Cited by-同舟云学术

The present thermal science and beyond

Published:2024 Issue:3 Part A Volume:28 Page:1955-1958
ISSN:0354-9836
Container-title:Thermal Science
language:en
Short-container-title:Therm sci

Author:

Wei Li¹,Zhao Lei¹,Alsolami Abdulrahman²,He Ji-Huan³

Affiliation:

1. Textile and Clothing College, Yancheng Polytechnic College, Yancheng, China

2. Department of Mathematics, Faculty of Science, King Abdulaziz University, Jeddah, Saudi Arabia

3. National Engineering Laboratory for Modern Silk, College of Textile and Clothing Engineering, Soochow University, Suzhou, China

Abstract

The Fourier law and its various modifications have been widely used to study various thermal problems with great success, but many thermal phenomena cannot yet be explained, for example, the effect of pore size and distribution on the heat transfer of a porous medium, the extremely high thermal conductivity of metasurfaces, and the moisture transfer through a fabric. This short article shows the current state of thermal science for modern science and technology, and its challenge in the future.

Publisher

National Library of Serbia

Reference30 articles.

1. He, C.-H., et al., A Fractal Model for the Internal Temperature Response of a Porous Concrete, Applied and Computational Mathematics, 21 (2022), 1, pp. 71-77

2. Pichugin, Z., et al., Weighted Geometric Mean Model for Determining Thermal Conductivity of Reservoir Rocks: Current Problems with Applicability and the Model Modification, Geothermics, 104 (2022), 102456

3. Blocka, C., et al., Effects of Moisture Content and Porosity on the Thermal Conductivity and Volumetric Specific Heat Capacity of Pharmaceutical Powders, International Journal of Pharmaceutics, 642 (2023), 123130

4. Mishra, S. R., et al., Sensitivity Analysis on Enhanced Thermal Transport in Eyring-Powell Nanofluid Flow: Investigating Over a Radiating Convective Riga Plate with Non-Uniform Heat Source/Sink Under Flux Conditions, Journal of Thermal Analysis and Calorimetry, 149 (2024), 2, pp. 711-728

5. Zuo, Y. T., Liu, H. J., Effect of Temperature on the Bubble-Electrospinning Process and Its Hints for 3-D Printing Technology, Thermal Science, 26 (2022), 3B, pp. 2499-2503