Affiliation:
1. Drexel University, Materials Engineering Department, Philadelphia, USA
Abstract
Copper electrodeposition from copper acid solutions containing PEG and NaCl
has been investigated onto Cu(111), Cu(100) and polycrystalline copper
electrodes using polarization and EIS measurements. The adsorption of
sulphate and chloride anions, and PEG molecules, was investigated onto
Cu(111) and Cu(100) by cyclic voltammetry and differential capacitance
measurements. Differential capacitance vs. potential curves recorded onto
Cu(100) in solutions containing 0.1 M H2SO4, 0.1 M H2SO4 + 10-3 M PEG and
0.1MH2SO4 + 10-3MPEG + 10-3MNaCl confirm that ?specific adsorption?
of PEG molecules occurs in the absence of NaCl in the solution, in the
potential region of copper electrodeposition, e.g., between -1.0 V and -0.5
V vs. SSE. In the presence of chloride ions, the adsorption of PEG molecules
is suppressed and there is no evidence of adsorption of neutral PEG
molecules. It is shown that hysteresis, appearing on the polarization curves
of copper electrodeposition, is not a consequence of competition between
inhibition provided by the Cl-PEG/Cu2+/Cu+/Cu interface and the catalytic
effects of Cl-MPSA/Cu2+/Cu+/Cu interaction, because hysteresis is present in
the solution containing only PEG and NaCl, e.g., in the absence of MPSA. EIS
measurements confirm the simultaneous occurrence of two processes during
copper electrodeposition: deposition of copper by discharge of Cu2+ ions and
?specific adsorption? and discharge of some heavily charged species, most
probably containing Cu, PEG and Cl.
Publisher
National Library of Serbia
Cited by
46 articles.
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