Affiliation:
1. Lodz University of Technology, Department of Microelectronics and Computer Science, Poland
Abstract
This paper illustrates, based on a practical example of a hybrid circuit, the
influence of proper heat transfer coefficient modelling in air cooled
electronic systems on the accuracy of thermal simulations. This circuit
contains a transistor heat source and a set of temperature sensors. The
measurements of their temperature responses are taken in natural convection
and forced air cooling conditions. The experimental data provide the
information necessary to estimate the local heat transfer coefficient values
in heat source and temperature sensor locations. Moreover, the experiments
rendered possible the fitting of parameters of an empirical heat transfer
coefficient model for different surface temperature rise values and cooling
air velocities, and hence allowed significant improvement of thermal
simulation accuracy.
Publisher
National Library of Serbia
Cited by
1 articles.
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1. Considerations on Electronic System Compact Thermal Models in the Form of RC Ladders;2019 IEEE 15th International Conference on the Experience of Designing and Application of CAD Systems (CADSM);2019-02