Author:
Matsumoto T.,Kudoh Y.,Tahara M.,Yu K.-H.,Miyakawa N.,Itani H.,Ichikizaki T.,Fujiwara A.,Tsukamoto H.,Koyanagi M.
Publisher
The Japan Society of Applied Physics
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Bendability Enhancement and Miniaturization of Through-X Via (TXV) Based on Flexible FOWLP with Tiny Cu Pillar Assembly;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. チップレットの概念と3D-ICのラピッドプロトタイピング;Journal of The Japan Institute of Electronics Packaging;2023-07-01
3. Fundamentals of TSV and Recent Trend of 3D Integration & Packaging;Journal of The Japan Institute of Electronics Packaging;2022-11-01
4. CMOS Image Sensor;CMOS Integrated Lab-on-a-Chip System for Personalized Biomedical Diagnosis;2018-04-16
5. Eutectic AuIn Bonding;Handbook of Wafer Bonding;2012-02-08