Room-temperature intermixing for adhesion enhancement of Cu/SiO2interface by adopting SiO2surface dope and noble metal catalyzation
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/53/i=5S2/a=05GA02/pdf
Reference30 articles.
1. Enhanced adhesion of copper to dielectrics via titanium and chromium additions and sacrificial reactions
2. Low-temperature passivation of copper by doping with Al or Mg
3. Adhesion Mechanism of Electroless Copper Film Formed on Ceramic Substrates Using ZnO Thin Film as an Intermediate Layer
4. Adhesion modification in (Cu, Nb, Ti)/SiO2 pairs by argon ion bombardment
5. Behavior of Cu0.6Al0.4 films at the SiO2 interface
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