Selective deposition on electrodes of chip component by electroless plating method-Reference-Cited by-同舟云学术

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Selective deposition on electrodes of chip component by electroless plating method

Published:2014-04-09 Issue:5 Volume:53 Page:056503
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Yamamoto Akihiro,Watanabe Nobuaki,Arakawa Tomiyuki,Gotou Miku,Nakada Tatsunosuke,Fukui Kenta,Hashimoto Akira,Koiwa Ichiro

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference38 articles.

1. Modern Electroplating

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electroless Metallization of the Elements: Survey and Progress;ACS Applied Electronic Materials;2022-12-07

2. A novel silver / activated - polyvinylidene fluoride - polydimethyl siloxane hydrophilic-hydrophobic Janus membrane for vacuum membrane distillation and its anti-oil-fouling ability;Journal of Membrane Science;2021-11

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