Evaluation of crack closure stress by analyses of ultrasonic phased array images during global preheating and local cooling
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/53/i=7S/a=07KC20/pdf
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1. White Light-Emitting Diodes Using Sr-Containing Sialon Phosphors
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3. Nondestructive Evaluation of Plane Crack Tip in a Thin Plate Using Laser-Induced Pulse Wave and Symmetric Lamb Wave
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