Synthesis of three-component nanoparticles using Sn–58Bi and Cu wires by the pulsed wire discharge method
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/55/i=11/a=116203/pdf
Reference22 articles.
1. Lead (Pb)-free solders for electronic packaging
2. Microstructural evolution in Sn/Pb solder and Pb/Ag thick film conductor metallization
3. Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper
4. Investigation of multi-component lead-free solders
5. Effect of compositional changes and impurities on wetting properties of eutectic Sn–Bi alloy used as solder
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1. Bimetallic Al Ag, Al Cu and Al Zn nanoparticles with controllable phase compositions prepared by the electrical explosion of two wires;Powder Technology;2020-07
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