Loss reduction of longitudinal-type leaky surface acoustic wave by loading with high-velocity thin film
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/53/i=7S/a=07KD04/pdf
Reference26 articles.
1. Magnetic Sensor Based on Surface Acoustic Wave Resonators
2. Study of Relationship between Layer Profile of SiO2and Characteristics of Surface Acoustic Wave Devices in SiO2/Al/LiTaO3System
3. Zero Temperature Coefficient of Frequency Surface Acoustic Wave Resonator for Narrow-Duplex-Gap Application on SiO2/Al/LiNbO3Structure
4. In-situContamination Thickness Measurement by Novel Resist Evaluation System at NewSUBARU
5. Two-Dimensional Coupling-of-Modes Analysis in Surface Acoustic Wave Device Performed by COMSOL Multiphysics
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