Effect of high voltage stress on the DC performance of the Al2O3/AlN GaN metal–insulator–semiconductor high-electron mobility transistor for power applications
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,General Engineering
Link
http://stacks.iop.org/1882-0786/8/i=10/a=104102/pdf
Reference22 articles.
1. High On/Off Ratio in Enhancement-Mode AlxGa1-xN/GaN Junction Heterostructure Field-Effect Transistors with P-Type GaN Gate Contact
2. High breakdown GaN HEMT with overlapping gate structure
3. High-power microwave GaN/AlGaN HEMTs on semi-insulating silicon carbide substrates
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1. Comprehensive dynamic on-resistance assessments in GaN-on-Si MIS-HEMTs for power switching applications;Semiconductor Science and Technology;2018-04-23
2. AlGaN/GaN MIS-HEMTs With High Quality ALD-Al2O3 Gate Dielectric Using Water and Remote Oxygen Plasma As Oxidants;IEEE Journal of the Electron Devices Society;2018
3. Evaluation of AlGaN/GaN metal–oxide–semicondutor high-electron mobility transistors with plasma-enhanced atomic layer deposition HfO2/AlN date dielectric for RF power applications;Japanese Journal of Applied Physics;2017-08-24
4. Simulation Model Development for Packaged Cascode Gallium Nitride Field-Effect Transistors;Crystals;2017-08-09
5. Investigation of enhancement-mode AlGaN/GaN nanowire channel high-electron-mobility transistor with oxygen-containing plasma treatment;Applied Physics Express;2017-04-12
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