Investigation of the Thermal Dissipation Characteristics of a Light-Emitting Diode Package Using Mold Surface Temperature
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference20 articles.
1. Influence of controlled growth rate on tilt mosaic microstructures of nonpolar a-plane GaN epilayers grown on r-plane sapphire
2. Structural, optical, and electrical properties of E-beam and sputter-deposited ITO films for LED applications
3. Thermal transient characteristics of die attach in high power LED PKG
4. Thermal Study of High-Power Nitride-Based Flip-Chip Light-Emitting Diodes
5. Improvement of thermal management of high-power GaN-based light-emitting diodes
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