Highly conductive metal interconnects on three-dimensional objects fabricated with omnidirectional ink jet printing technology
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/56/i=5S2/a=05EA01/pdf
Reference28 articles.
1. Fabrication of metallic microstructure on curved substrate by optical soft lithography and copper electroplating
2. Transfer printing by kinetic control of adhesion to an elastomeric stamp
3. Screen-pad printing for electrode patterning on curvy surfaces
4. Circuitry in three dimensions: multifunctional molded plastic packages
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