Effect of ZnO micron-particles on properties and intermetallic compound layers of a Sn3.0Ag0.5Cu solder
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
https://iopscience.iop.org/article/10.7567/1347-4065/ab1e38/pdf
Reference30 articles.
1. Influence of minor POSS molecules additions on the microstructure and hardness of Sn3Ag0.5Cu–xPOSS composite solders
2. The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction
3. Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps
4. Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint
5. Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder
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