Elastic–plastic deformation of single-crystal silicon in nano-cutting by a single-tip tool

Abstract

Abstract A material removal mechanism of a single-tip tool cutting/scratch is the foundation for the analysis and prediction of the grinding process. A novel method for conducting single-tip, relatively high speed, and force-measurable nano-cutting tests with controllable cutting length are proposed to investigate the elastic–plastic deformation. Nano-cutting tests of single-crystal silicon are implemented at the cutting speeds of 0.1 m s−1 and 1 m s−1 which are close to the real grinding speed and much higher than that of single-tip tool scratch tests reported. Remarkable elastic recovery rate over 50% is observed in both cutting speeds. A semi-empirical model describing the relationship between the elastic recovery rate and residual depth is proposed. The normal force is studied in the whole cutting range. The findings of the elastic–plastic deformation behavior under relatively high cutting speed are valuable for the further mechanisms and process analysis of the ultra-fine grinding of brittle materials.