THERMAL ANALYSIS OF A SILICON WAFER PROCESSING COMBINATION BAKE-CHILL STATION USED IN MICROLITHOGRAPHY-Reference-Cited by-同舟云学术

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THERMAL ANALYSIS OF A SILICON WAFER PROCESSING COMBINATION BAKE-CHILL STATION USED IN MICROLITHOGRAPHY

Published:2005-03-16 Issue:2 Volume:20 Page:273-286
ISSN:1042-6914
Container-title:Materials and Manufacturing Processes
language:en
Short-container-title:Materials and Manufacturing Processes

Author:

Narasimhan Arunn

Publisher

Informa UK Limited

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://www.tandfonline.com/doi/pdf/10.1081/AMP-200042048

Reference19 articles.

1. Introduction to Microlithography

2. 2nd Ed.;Thompson L.F.,1994

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