brittle-ductile TRANSITION IN DIAMOND CUTTING OF SILICON SINGLE CRYSTALS-Reference-Cited by-同舟云学术

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brittle-ductile TRANSITION IN DIAMOND CUTTING OF SILICON SINGLE CRYSTALS

Published:2001-09-30 Issue:4 Volume:16 Page:447-460
ISSN:1042-6914
Container-title:Materials and Manufacturing Processes
language:en
Short-container-title:Materials and Manufacturing Processes

Author:

Zhou Ming,Ngoi B. K. A.,Zhong Z. W.,Chin C. S.

Publisher

Informa UK Limited

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://www.tandfonline.com/doi/pdf/10.1081/AMP-100108519

Reference12 articles.

1. Hashimoto, H. 1988.Machining of Aspherical Surfaces164–186. London: Springer-Verlag.

2. Investigation of Cutting Temperature and Tool Wear in Diamond Cutting of Glasses

3. Machining High-Precision Mirrors Using Newly Developed CNC Machine

4. On Material Removal Mechanisms in Finishing of Advanced Ceramics and Glasses

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2. Review of single-point diamond turning process on IR optical materials;Materials Today: Proceedings;2022

3. Towards understanding the brittle–ductile transition in the extreme manufacturing;International Journal of Extreme Manufacturing;2021-02-24

4. RSM and MD—a roughness predictive model and simulation comparison of monocrystalline optical grade silicon;The International Journal of Advanced Manufacturing Technology;2020-11-20

5. Prediction of critical undeformed chip thickness for ductile mode to brittle transition in the cutting of single-crystal silicon;Semiconductor Science and Technology;2020-07-27

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