Wafer‐level vacuum‐encapsulated silicon resonators with arc‐welded electrodes

Author:

Xereas George1,Chodavarapu Vamsy P.2

Affiliation:

1. Department of Electrical and Computer EngineeringMcGill UniversityMontrealQuebecH3A0E9Canada

2. Department of Electrical and Computer EngineeringKettering LaboratoriesUniversity of DaytonDaytonOH45469USA

Funder

CMC Microsystems

University of Dayton

Natural Sciences and Engineering Research Council of Canada

Publisher

Institution of Engineering and Technology (IET)

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering

Reference15 articles.

1. MEMS technology for timing and frequency control

2. Technologies for Cofabricating MEMS and Electronics

3. Wafer-Level Vacuum-Encapsulated Lamé Mode Resonator With f-Q Product of $2.23 \times 10^{13}$ Hz

4. KhineL.PalaniapanM.LichunS.et al.: ‘Characterization of SOI Lame‐mode square resonators’.Int. Frequency Control Symp. Honolulu USA May2008 pp.625–628

5. A simple model of feedback oscillator noise spectrum

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