Affiliation:
1. Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME)National Institute of Advanced Industrial Science and Technology (AIST)TsukubaIbaraki305‐8564Japan
Publisher
Institution of Engineering and Technology (IET)
Subject
Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering
Reference21 articles.
1. TopolA.W.FurmanB.K.GuariniK.W.ShiL.CohenG.M.WalkerG.F.: ‘Enabling technologies for wafer‐level bonding of 3D MEMS and integrated circuit structures’.Proc. 54th Electronic Components and Technology Conf. (ECTC2004) Las Vegas NV USA June2004 pp.931–938
2. Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS
3. ShengK.C.W.PremachandranC.S.KyondC.W.et al.: ‘C2W bonding method for MEMS applications’.Proc. 10th Electronics Packaging Technology Conf. (EPTC2008) Singapore December2008 pp.1283–1287
4. WitvrouwA.: ‘CMOS‐MEMS integration: why how and what’.Proc. IEEE/ACM Int. Conf. Computer‐aided Design San Jose CA USA November2006 pp.826–827
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