Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites-Reference-Cited by-同舟云学术

Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites

Published:2022-02-14 Issue:5 Volume:7 Page:960-967
ISSN:2397-7264
Container-title:High Voltage
language:en
Short-container-title:High Voltage

Author:

Wei Wenfu¹^ORCID,Huang Zhanglin¹,Yin Guofeng¹^ORCID,Yang Zefeng¹²^ORCID,Li Xiaobo¹,Zuo Haozi¹,Deng Qin¹,Huang Guizao¹^ORCID,Ren Junwen³,Liao Qianhua¹,Yang Yan⁴,Wu Guangning¹

Affiliation:

1. School of Electrical Engineering Southwest Jiaotong University Chengdu China

2. Handley Electronic Co., Ltd Changzhou China

3. College of Electrical Engineering Sichuan University Chengdu China

4. School of Electrical & Electronic Engineering Nanyang Technological University Singapore Singapore

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/hve2.12190

Reference47 articles.

1. Influence of carbon coating with phenolic resin in natural graphite on the microstructures and properties of graphite/copper composites

2. Graphite fiber/copper composites prepared by spontaneous infiltration

3. Study on the erosion characteristics of copper‐carbon electrode pairs by DC air arc

4. Wetting of graphite by molten Cu–xSn–yCr ternary alloys at 1373 K

5. Effect of Cr on the wetting in Cu/graphite system

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