Multilayer packaging dual‐band balanced bandpass filter based on dual‐mode substrate integrated waveguide cavities with split‐type topology-Reference-Cited by-同舟云学术

Multilayer packaging dual‐band balanced bandpass filter based on dual‐mode substrate integrated waveguide cavities with split‐type topology

Published:2022-11-08 Issue:3 Volume:17 Page:200-207
ISSN:1751-8725
Container-title:IET Microwaves, Antennas & Propagation
language:en
Short-container-title:IET Microwaves Antenna & Prop

Author:

Sun Xiaohang¹,Zhou Xin²^ORCID,Li Yibing¹,Gu Xiaojun¹^ORCID,Xu Bin¹,Tam Kam Weng³,Zhang Gang²^ORCID

Affiliation:

1. Hengdian Electronics Co., Ltd. Nanjing China

2. School of Electrical and Automation Engineering and the Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing Nanjing Normal University Nanjing China

3. Department of Electrical and Computer Engineering, Faculty of Science and Technology University of Macau Macau China

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/mia2.12320

Reference24 articles.

1. Guided-wave and leakage characteristics of substrate integrated waveguide

2. Quarter-Mode Substrate Integrated Waveguide and Its Application to Antennas Design

3. Substrate Integrated Waveguide Cross-Coupled Filter With Negative Coupling Structure

4. Substrate integrated folded waveguides (SIFW) and filters

5. Half Mode Substrate Integrated Waveguide (HMSIW) Bandpass Filter

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