A modulation optimization‐based active thermal control method for H‐bridge rectifiers-Reference-Cited by-同舟云学术

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A modulation optimization‐based active thermal control method for H‐bridge rectifiers

Published:2021-08-06 Issue:13 Volume:14 Page:2278-2288
ISSN:1755-4535
Container-title:IET Power Electronics
language:en
Short-container-title:IET power electron.

Author:

Chen Wenbo¹^ORCID,Chen Shujing²,Qiu Hongbo¹,Cheng Hong³

Affiliation:

1. College of Electrical and Information Engineering Zhengzhou University of Light Industry Zhengzhou Henan People's Republic of China

2. Testing and Training Laboratory Henan College of Industry & Information Technology Jiaozuo Henan People's Republic of China

3. School of Mechanical Electronic & Information Engineering China University of Mining and Technology Beijing Beijing People's Republic of China

Funder

Zhengzhou University of Light Industry

Fundamental Research Funds for the Central Universities

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/pel2.12177

Reference25 articles.

1. Lifetime-Based Power Routing of a Quadruple Active Bridge DC/DC Converter

2. Lifetime estimation of DC‐link capacitors in adjustable speed drives under grid voltage unbalances;Wang H.;IEEE Trans. Power Electron.,2018

3. A Short-Time Transition and Cost Saving Redundancy Scheme for Medium-Voltage Three-Phase Cascaded H-Bridge Electronic Power Transformer

4. Control of a Single-Phase Cascaded H-Bridge Active Rectifier Under Unbalanced Load

5. An Industry-Based Survey of Reliability in Power Electronic Converters

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Single‐stage ZVS boost integrated push–pull power factor correction converter;IET Power Electronics;2024-07-29

2. Review of Active Thermal Control for Power Electronics: Potentials, Limitations, and Future Trends;IEEE Open Journal of Power Electronics;2024

3. Enhancing Bridge Structural Stability: A Comprehensive Analysis of Thermodynamic Properties and Thermal Stress Performance;International Journal of Heat and Technology;2023-06-30

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