CPW‐to‐SL transition in LTCC technology-Reference-Cited by-同舟云学术

CPW‐to‐SL transition in LTCC technology

Published:2017-04 Issue:9 Volume:53 Page:609-611
ISSN:0013-5194
Container-title:Electronics Letters
language:en
Short-container-title:Electron. lett.

Author:

Bhutani A.¹^ORCID,Goettel B.¹,Thelemann T.²,Zwick T.¹

Affiliation:

1. Institute of Radio Frequency Engineering and Electronics (IHE)Karlsruhe Institute of Technology (KIT)Engesserstrasse 5Karlsruhe76131Germany

2. Research & Development LTCC, Micro‐Hybrid Electronic GmbHGustav‐Kirchhoff‐Strasse 5Ilmenau98693Germany

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/el.2017.0140

Reference5 articles.

1. Antenna‐on‐chip and antenna‐in‐package solutions to highly integrated millimeter‐wave devices for wireless communications;Zhan Y.P.;IEEE Trans. Antennas Propag.,2009

2. LTCC Packages With Embedded Phased-Array Antennas for 60 GHz Communications

3. DuPont Microcircuit Materials: ‘low temperature co‐fired ceramic system: design and layout and guidelines’. Available athttp://www.dupont.com/content/dam/dupont/products‐and‐services/electronic‐and‐electrical‐materials/documents/prodlib/GreenTape_Design_Layout_Guidelines.pdf accessed June 2015

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