A comprehensive packaging solution from DC to 113 GHz for InGaAs amplifiers

Author:

Valenziano Luca1ORCID,Hebeler Joachim1ORCID,Sherifaj Alban2,Thome Fabian3ORCID,Koos Christian2,Zwick Thomas1,Bhutani Akanksha1ORCID

Affiliation:

1. Institute of Radio Frequency Engineering and Electronics (IHE) Karlsruhe Institute of Technology Karlsruhe Germany

2. Institute of Photonics and Quantum Electronics (IPQ) Karlsruhe Institute of Technology Karlsruhe Germany

3. Fraunhofer Institute for Applied Solid State Physics IAF Freiburg im Breisgau Germany

Abstract

AbstractThis letter presents the design, fabrication and measurement of a 72 kHz to 113 GHz ultra‐broadband amplifier that includes a direct current (DC)‐blocking functionality. This amplifier module stands out with a high average gain of 12.5 dB in the frequency range from almost DC to 110 GHz. This work not only combines electrical interconnections but also mechanical design considerations, thermal requirements and practical application specific aspects. To ensure a low thermal resistance, the InGaAs amplifier IC is directly mounted on an aluminium submount, applying an advanced gluing concept, and interconnected to an input and output 50 grounded coplanar waveguide by wire bonds with a length of only 135 . To enable convenient usage of the package, 1 mm connectors are utilized. This amplifier module exhibits excellent thermal behaviour and group delay characteristics, making it an ideal choice for use in optical data transmission experiments.

Funder

Deutsche Forschungsgemeinschaft

Bundesministerium für Bildung und Forschung

Publisher

Institution of Engineering and Technology (IET)

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