Simulation study on squeeze film air damping-Reference-Cited by-同舟云学术

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Simulation study on squeeze film air damping

Published:2020-08 Issue:9 Volume:15 Page:576-581
ISSN:1750-0443
Container-title:Micro & Nano Letters
language:en
Short-container-title:Micro & Nano Letters

Author:

Tian Xiang¹^ORCID,Sheng Wei¹,Tian Feifei²,Lu Yang¹,Wang Longyun³

Affiliation:

1. School of Instrumentation and Optoelectronic EngineeringBeihang UniversityBeijing100191People's Republic of China

2. Beijing Yanping Hydraulic Engineering Survey and Design Co. LTDBeijing102200People's Republic of China

3. School of Energy and Power EngineeringBeihang UniversityBeijing100191People's Republic of China

Publisher

Institution of Engineering and Technology (IET)

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/mnl.2019.0566

Reference24 articles.

1. On Isothermal Squeeze Films

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1. Low-Frequency High-Resolution Fiber Fabry–Perot Interferometric Accelerometer Based on Double-Spring-Supported Oscillator;IEEE Sensors Journal;2024-06-01

2. A Brief Review on the Asymptotic Methods for the Periodic Behaviour of Microelectromechanical Systems;J APPL COMPUT MECH;2022

3. Modeling and Analysis of a SiC Microstructure-Based Capacitive Micro-Accelerometer;Materials;2021-10-19

4. Model Order Reduction via Moment-Matching: A State of the Art Review;Archives of Computational Methods in Engineering;2021-06-25

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