Author:
Robertson W.M.,Arjavalingam G.,Hougham G.,Kopcsay G.V.,Edelstein D.,Ree M.-H.,Chapple-Sokol J.D.
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Reference7 articles.
1. Lupinsk, J.H., and Moor, R.S.: Polymeric materials for electronics packaging and interconnection, (American Chemical Society, Washington 1989)
Cited by
16 articles.
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