Fully embedded ultra‐wideband multilayer balun into organic packaging substrate
Author:
Affiliation:
1. Department of Electrical, Electronic and Computer EngineeringSchool of Engineering and Physical SciencesHeriot‐Watt UniversityEdinburghEH14 4ASUK
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/iet-map.2018.5859
Reference12 articles.
1. Uniplanar broad-band push-pull FET amplifiers
2. Wideband balun bandpass filter explored for a balanced dipole antenna with high selectivity
3. Development of Packaged Ultra-Wideband Bandpass Filters
4. Cervera F. Hong J. Thomson N.: ‘Development of packaged UWB passive devices using LCP multilayer circuit technology’.Proc. of the 7th European Microwave Integrated Circuits Conf. Amsterdam Netherlands 29 October – 1 November2012 pp.770–773
5. Jiang W.‐B. Jin L. Hu J.‐G. et al.: ‘Design of a miniaturized balun using low temperature co‐fired ceramic technology’.IEEE Electrical Design of Advanced Packaging & System Symp. (EDAPS) Singapore December2010 pp.1–4
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