Three‐dimensional printed ABS plastic peanut‐lens with integrated ball grid array module for high‐data‐rate communications in F‐band

Author:

Bisognin Aimeric12,Arboleya Ana1,Luxey Cyril1,Gianesello Frederic2,Gloria Daniel2,Matos Sérgio A.34,Costa Jorge R.34,Fernandes Carlos A.4

Affiliation:

1. Polytech'LabUniversity Nice Côte d'AzurCampus Sophia‐TechFrance

2. STMicroelectronicsCrollesFrance

3. DCTIInstituto Universitário de Lisboa (ISCTE‐IUL)LisbonPortugal

4. Instituto de TelecomunicaçõesInstituto Superior TécnicoLisbonPortugal

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Reference25 articles.

1. WiGiG: Multi-gigabit wireless communications in the 60 GHz band

2. ‘Peraso “W” series products’ Peraso Technologies. Available athttp://perasotech.com/w‐series‐products/ accessed 5 March 2017

3. ‘Qualcomm Snapdragon 801 processor’. Available athttps://www.qualcomm.com/products/snapdragon/processors/810 accessed 5 March 2017

4. ‘Intel wireless Gigabit (802.11ad) products’. Available:http://www.intel.com/content/www/us/en/wireless‐products/wireless‐product‐selection‐guide.html accessed 5 March 2017

5. Ball Grid Array-Module With Integrated Shaped Lens for WiGig Applications in Eyewear Devices

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