Integrated passive device fabricated and chip‐on‐board packaged filter employing mixed electric–magnetic coupling scheme
Author:
Affiliation:
1. RFIC CenterKwangwoon University447‐1 Wolgye‐DongNowon‐kuSeoul139‐701Republic of Korea
2. School of Electronics and Information EngineeringHarbin Institute of TechnologyHarbin150‐001People's Republic of China
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/iet-map.2018.5492
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