Electromagnetic band‐gap based corrugated structures for reducing mutual coupling of compact 60 GHz cavity‐backed antenna arrays in low temperature co‐fired ceramics
Author:
Affiliation:
1. Graduate Institute of Communication EngineeringNational Taiwan UniversityNo. 1, Sec. 4, Roosevelt RoadTaipei10617Taiwan
2. Department of Electrical EngineeringNational Taiwan UniversityNo. 1, Sec. 4, Roosevelt RoadTaipei10617Taiwan
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/iet-map.2012.0674
Reference17 articles.
1. Exploiting the 60 GHz band for local wireless multimedia access: prospects and future directions
2. On-chip integrated antenna structures in CMOS for 60 GHz WPAN systems
3. A Fully Integrated 16-Element Phased-Array Transmitter in SiGe BiCMOS for 60-GHz Communications
4. 60-GHz Four-Element Phased-Array Transmit/Receive System-in-Package Using Phase Compensation Techniques in 65-nm Flip-Chip CMOS Process
5. Antenna-on-Chip and Antenna-in-Package Solutions to Highly Integrated Millimeter-Wave Devices for Wireless Communications
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